E-Beam 1 Evaporation - Semi Conductor [Timed]

Deposit Au, Ti, Ni, Cr, Si, Ge, Pt with this 4-pocket e-beam evaporator (additional materials require clearance). Wafers load onto a stationary holder. System reaches ultra-high vacuum (2e-6 Torr) in ~2 hours with a cryo pump. Real-time thickness monitoring by INFICON XTC/2.

Category: Semiconductor
Grades: Grades 9-12
Variant: Timed
Standards: NGSS Engineering
Plays on: VRDesktopWeb

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Lab objectives and outcomes

Students will be able to explain the function of the cryo pump in achieving ultra-high vacuum for e-beam evaporation.
Students will be able to demonstrate the correct step-by-step procedure for loading wafers into the stationary holder of the 4-pocket e-beam evaporator.
Students will be able to operate the e-beam evaporator to deposit a specified material (e.g., Au, Ti) and interpret real-time thickness monitoring data from the INFICON XTC/2 to ensure the target thickness is achieved.

E-Beam 1 Evaporation - Semi Conductor [Timed Unguided]
Deposit Au, Ti, Ni, Cr, Si, Ge, Pt with this 4-pocket e-beam evaporator (additional materials require clearance). Wafers load onto a stationary holder. System reaches ultra-high vacuum (2e-6 Torr) in ~2 hours with a cryo pump. Real-time thickness monitoring by INFICON XTC/2.
SemiconductorGrades 9-12

Suggested activities

E-Beam 1 Evaporation - Semi Conductor Quiz

Pre-assessment

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E-Beam 1 Evaporation - Semi Conductor Discussion

Post-assessment

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E-Beam 1 Evaporation - Semi Conductor [Unguided]

Deposit Au, Ti, Ni, Cr, Si, Ge, Pt with this 4-pocket e-beam evaporator (additional materials require clearance). Wafers load onto a stationary holder. System reaches ultra-high vacuum (2e-6 Torr) in ~2 hours with a cryo pump. Real-time thickness monitoring by INFICON XTC/2.

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